Aluminum Nitride Ceramic AMB Copper-clad Substrate

Aluminum Nitride Ceramic AMB Copper-clad Substrate Product Overview Puwei Ceramic's Aluminum Nitride Ceramic AMB Copper-clad Substrate represents a breakthrough in high-performance electronic packaging solutions. Designed for extreme environments, this substrate leverages the exceptional thermal conductivity of Aluminum Nitride (AlN) – significantly higher than traditional materials like aluminum oxide and silicon nitride. It efficiently dissipates heat in high-power, high-current applications, ensuring reliability and longevity. The Active Metal Brazing (AMB) technology employed creates a robust bond between the ceramic and copper layers, offering superior resistance to thermal and mechanical stress. As a leader in advanced ceramics, Puwei Ceramic also produces related products like Alumina Ceramic Substrates and DBC Ceramic Substrates, providing a comprehensive range of solutions for the electronics industry. Our AMB AlN substrates are ideal for demanding sectors such as electric…

AlN Ceramic Structure Parts AlN Ceramic Components 96 Alumina Ceramic Substrate AlN Ceramic Substrate Alumina Ceramic Disc