Aluminum Nitride Ceramic AMB Copper-clad Substrate

Aluminum Nitride Ceramic AMB Copper-clad Substrate Product Overview Puwei Ceramic's Aluminum Nitride Ceramic AMB Copper-clad Substrate represents the pinnacle of thermal management technology for advanced power electronics. Engineered specifically for extreme environment applications, this substrate leverages the exceptional thermal conductivity of Aluminum Nitride (AlN) - 5-10 times higher than traditional aluminum oxide ceramics. Core Performance Advantages Superior Thermal Conductivity: 170-200 W/m·K (5-10x higher than Al₂O₃) Exceptional Bonding Strength: >70 MPa peel strength for maximum reliability Advanced AMB Technology: Metallurgical bonds outperform traditional DBC methods Optimized CTE Matching: Closely matches semiconductor materials Proven Thermal Cycling: Withstands 5,000+ cycles (-55°C to 150°C) Utilizing advanced Active Metal Brazing (AMB) technology, we create robust metallurgical bonds between high-purity AlN ceramic and oxygen-free copper layers. This innovat…

AlN Ceramic Structure Parts AlN Ceramic Components 96 Alumina Ceramic Substrate AlN Ceramic Substrate Alumina Ceramic Disc