High-Capacity Thermal Dissipation in a Stamped Form The Large Corrugated Stamped Aluminum Heat Sink (100mm × 151mm) delivers robust passive cooling for mid-to-high-power electronics without the cost or lead time of extrusion. Its surface features continuous wave-like fins formed through precision Al Stamping Type technology—each undulation acting as a turbulence generator that enhances convective heat transfer even at low airflow speeds. This makes it ideal for AC/DC power supplies, motor drives, telecom rectifiers, and industrial PLC backplanes. Why Corrugation Matters at Scale On a large footprint like 100×151mm, flat plates waste thermal potential. By introducing corrugated geometry via stamping, this Stamping Heat Sink increases effective surface area by 60–80% compared to a smooth plate—while maintaining structural rigidity across the entire span. The uniform fin pattern ensures consistent thermal performance from edge to center, eliminating hotspots common in bonded-fin alternat…

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Wenzhou Hesheng Electronic Co., Ltd.

Wenzhou Hesheng Electronics Co., Ltd. was established in 1998 in Yueqing city, Zhejiang Province, Ch…

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