Metal core copper clad substrate

Metal core copper clad substrate Product Overview Metal core copper clad substrate is a high-performance thermally conductive Base Material with metal (aluminum/iron) core and bonded copper foil, specially designed for high-power electronics. As one of the premium Quality Base Materials, it integrates excellent heat dissipation, electrical insulation, mechanical strength and stability, widely used in LED, power modules, automotive electronics and industrial control systems. Key Features Ultra-high thermal conductivity for efficient heat dissipation, a core advantage of this Base Material High electrical insulation and safe dielectric structure, meeting standards of Quality Base Materials Strong mechanical strength and rigid structural support, a highlight of reliable Durable Base Materials Excellent stability under high temperature & harsh environments, ideal for long-lasting Base Material High current carrying capacity and low thermal resistance, enhancing performance of Quality…

Base Material Products Low-temperature Insulation Products High-temperature Heat Insulation Products