Prototype PCB Assembly of Communication Equipment

Prototype PCB Assembly of Communication Equipment Name: Prototype PCB Assembly of Communication EquipmentSMT Lines: 7 high-speed SMT patch production linesDaily SMT Capacity: Over 30 million pointsInspection Equipment: X-RAY inspection machine, first piece tester, AOI automatic optical inspection machine, ICT tester, BGA rework stationMounting Speed: Chip component mounting speed (optimal state) 0.036 S/pieceSmallest Pitch Capability: 0201, with an accuracy of ±0.04mmMinimum Device Precision: Capable of mounting devices such as PQCC, QFP, BGA, CSP, etc., with pin pitches up to ±0.04mmIC Mounting Precision: High level of precision in mounting ultra-thin PCBs, flexible PCBs, and gold fingers. Capable of mounting/inserting/mixed assembly TFT display driver boards, mobile phone motherboards, battery protection circuits, and other challenging products. Product Details There are more than 50 SMT production lines, equipped with new imported Fuji NXTIII, AIMEX, XPF automatic so…

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