KOOCU UV-559 Flux paste
Environmentally friendly lead-free low temperature melting point tin solder paste welding CPU rework solder paste high temperature rosin solder mud
Unique solder paste series Full solder joints / no cold solder joints / less residue / strong adhesion / no need to clean
BRIGHT AND FULL
The solder joints are bright and full without any false solder joints.
Moderate viscosity, strong adhesion, not easy to collapse
Less residue after welding,High insulation resistance
Less residue after welding,Insulation solder mask, no corrosion
No need to clean
Needle welding without waste
Strong wettability
Good electrical properties
Good wettability and welding performance, suitable for a wider reflow soldering temperature range
Suitable for sensors,Microtechnology,Electronics,LED industry,Home appliances
wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT maintenance, BGA chip implantation, etc.