Superfine Micronized Dicyandiamide DCD 100S

KylinCure DCD 100S Superfine Micronized Dicyandiamide; Counterpart for Dyhard 100S / IsoQure DCD 100S / Omicure DDA 5   CAS Number: 461-58-5 Molecular Weight: 84.0874 Molecular Formula: C2H4N4   KylinCure DCD 100S is a superfine micronized dicyandiamide, widely utilized as a latent curing agent for epoxy resins, particularly in formulations requiring extended shelf life and controlled curing at elevated temperatures.  Its ultrafine particle size enhances dispersion within epoxy matrices, making it ideal for high-performance coatings, adhesives, composites, and electronic encapsulants. It reacts with epoxy resins very fast, at temperatures starting at about 180°C. At lower curing temperatures, KylinCure DCD 100S is used in combination with accelerators like KylinCure 200, KylinCure 300, KylinCure 400 and KylinCure 500.   Properties & Features   Latent Reactivity: Stable at ambient temperatures but rapidly activates curing upon heating (typically 150–180°C), enabling precise control…

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