Discover dgyzconn's precision-engineered 1.27 Mm Pin Header solution for next-gen SMT applications. Our surface-mount patch headers feature a compact 1.27 Mm Pitch Header design with optional stabilizing pillars, delivering unmatched reliability in high-vibration environments. The Pin Header 1.27 Mm series supports automated pick-and-place assembly while its gold-plated contacts ensure <5mΩ resistance. Ideal for medical IoT and micro-robotics, this 1.27 Pin Header offers dual configurations: pillar-enhanced versions prevent solder cracking in thermal-cycling scenarios, while pillar-free variants enable ultra-low-profile installations. Engineered with 260°C reflow tolerance and halogen-free materials, our 1.27mm SMT solutions exceed IPC-610 Class 3 standards. Upgrade your miniaturized designs with dgyzconn's cutting-edge connectivity.
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Description
Application
Primarily used for internal device connections, not for external connectivity.
Suitable for electronic products,…